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1

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - OpenCAPI Memory Interface Signal Integrity Study for High-Speed DDR5 Differential DIMM Channel with Standard Loss FR-4 Material and SNIA SFF-TA-1002 Connector

Cai, Biao, Hejase, Jose, Giesen, Kyle, Tang, Junyan, Connolly, Brian, Kim, KyuHyoun, Dreps, Daniel, Fan, Zhineng, Huang, Rocky, Yi, Luyun, Chen, Qiaoli, Huang, Yifan, Smith, Stephen

Year:

2019

Language:

english

File:

PDF, 3.01 MB

english, 2019

2

Sexual Harassment in the Workplace: An Exploratory Study from Lebanon

Hejase, Hussin Jose

Journal:

Journal of Management Research

Year:

2015

Language:

english

File:

PDF, 168 KB

english, 2015

3

[IEEE 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA (2018.10.14-2018.10.17)] 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - 3D Electromagnetic Modelling of Connector to PCB Via Transitions

Zhang, Yanyan, Hejase, Jose A., Myers, Joshua C., Audet, Jean J., Becker, Wiren D., Dreps, Daniel M.

Year:

2018

Language:

english

File:

PDF, 781 KB

english, 2018

4

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - OpenCAPI Memory Interface Signal Integrity Study for High-Speed DDR5 Differential DIMM Channel with Standard Loss FR-4 Material and SNIA SFF-TA-1002 Connector

Cai, Biao, Hejase, Jose, Giesen, Kyle, Tang, Junyan, Connolly, Brian, Kim, KyuHyoun, Dreps, Daniel, Fan, Zhineng, Huang, Rocky, Yi, Luyun, Chen, Qiaoli, Huang, Yifan, Smith, Stephen

Year:

2019

File:

PDF, 3.01 MB

2019

5

Demystifying Machine Learning for Signal and Power Integrity Problems in Packaging

Swaminathan, Madhavan, Torun, Hakki Mert, Yu, Huan, Hejase, Jose Ale, Becker, Wiren Dale

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2020

File:

PDF, 8.63 MB

2020

6

[IEEE 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2020.10.5-2020.10.7)] 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - SI Model to Hardware Correlation on a 44 Gb/s HLGA Socket Connector

Paladhi, Pavel Roy, Zhang, Yanyan, Tang, Junyan, Rodriguez, Daniel, Hejase, Jose, Chun, Sungjun, Becker, Wiren, Beaman, Brian, Dreps, Daniel

Year:

2020

File:

PDF, 574 KB

2020

7

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - DC wander effect of DC blocking capacitors on PCIe Gen3 signal integrity

Na, Nanju, Dreps, Daniel M., Hejase, Jose A.

Year:

2013

Language:

english

File:

PDF, 759 KB

english, 2013

8

Corrections to “Terahertz Characterization of Dielectric Substrates for Component Design and Nondestructive Evaluation of Packages” [Nov 11 1685-1694]

Hejase, Jose A., Paladhi, Pavel R., Chahal, Premjeet Prem

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 146 KB

english, 2013

9

[IEEE 2016 IEEE International Symposium on Electromagnetic Compatibility - EMC 2016 - Ottawa, ON, Canada (2016.7.25-2016.7.29)] 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) - High-speed bus signal integrity compliance using a frequency-domain model

Win, Si T., Hejase, Jose, Becker, Wiren D., Wiedemeier, Glen, Dreps, Daniel M., Myers, Joshua C., Willis, Ken, Horner, John, Varma, Ambrish

Year:

2016

File:

PDF, 736 KB

2016

10

[IEEE 2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Diego, CA, USA (2016.10.23-2016.10.26)] 2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) - Crosstalk evaluation between ultra high speed multi-layer compatible PCB dielectric waveguides and reduction using split ring resonators

Myers, Joshua C., Hejase, Jose A., Tang, Junyan, Dreps, Daniel M., Connor, Samuel R., Kuczynski, Joseph

Year:

2016

Language:

english

File:

PDF, 1.17 MB

english, 2016

11

[IEEE 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA (2017.10.15-2017.10.18)] 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - DC blocking capacitor interfacing for high speed communication buses

Tang, Junyan, Hejase, Jose A., Richardson, Matthew, Dreps, Daniel M., Becker, Wiren D., Kwark, Young H., Audet, Jean, Baks, Christian W.

Year:

2017

Language:

english

File:

PDF, 872 KB

english, 2017

12

[IEEE 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2018.10.14-2018.10.17)] 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - A Comprehensive Signal Integrity Study of Differential Pairs Routed within a PCB Via Field

Tang, Junyan, Hejase, Jose A., RoyPaladhi, Pavel, Beckir, Wiren D., Dreps, Daniel M.

Year:

2018

Language:

english

File:

PDF, 647 KB

english, 2018

13

A Hybrid Methodology for Jitter and Eye Estimation in High-Speed Serial Channels Using Polynomial Chaos Surrogate Models

Ahadi Dolatsara, Majid, Hejase, Jose Ale, Becker, Wiren Dale, Swaminathan, Madhavan

Journal:

Year:

2019

File:

PDF, 50 KB

2019

14

[IEEE 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Montreal, QC, Canada (2019.10.6-2019.10.9)] 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - An Approach For Tuning Signal Integrity Properties Of Edge Card Connectors With Conductive Fixture In High-Speed Link Channels

Zhang, Yanyan, Hejase, Jose A., Bohra, Mahesh, Paladhi, Pavel R., Shan, Lei, Chun, Sungjun, Audet, Jean J., Becker, Wiren D., Dreps, Daniel M.

Year:

2019

File:

PDF, 1.03 MB

2019

15

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - OpenCAPI Memory Interface Simulation and Test for Differential DIMM Channel with SNIA SFF-TA-1002 Connector

Car, Biao, Hejase, Jose, Mcilvain, Kevin, Giesen, Kyle, Chen, Zhaoqin, Zhang, Hongqing, Tang, Junyan, Nguyen, Megan, Baughen, Devon, Dreps, Daniel, Connolly, Brian, Wiedemeier, Glen, Becker, Dale, Chu

Year:

2020

File:

PDF, 4.41 MB

2020

16

Self-calibrating technique for terahertz time-domain material parameter extraction

Hejase, Jose A., Rothwell, Edward J., Chahal, Premjeet

Journal:

Journal of the Optical Society of America A

Year:

2011

Language:

english

File:

PDF, 1.08 MB

english, 2011

17

Genital fournier's gangrene: experience with 38 patients

Mohamed J. Hejase, Jose E. Simonin, Richard Bihrle, Christopher L. Coogan

Journal:

Year:

1996

Language:

english

File:

PDF, 2.01 MB

english, 1996

18

[IEEE 2011 36th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz 2011) - Houston, TX, USA (2011.10.2-2011.10.7)] 2011 International Conference on Infrared, Millimeter, and Terahertz Waves - Planar terahertz circuits using thin dielectric waveguides

Yang, Xianbo, Hejase, Jose, Paladhi, Pavel, Chahal, Premjeet

Year:

2011

Language:

english

File:

PDF, 252 KB

english, 2011

19

[IEEE 2012 IEEE Antennas and Propagation Society International Symposium and USNC/URSI National Radio Science Meeting - Chicago, IL, USA (2012.07.8-2012.07.14)] Proceedings of the 2012 IEEE International Symposium on Antennas and Propagation - Plasmonic waveguide coupling at terahertz frequencies

Myers, Joshua C., Meierbachtol, Collin S., Hejase, Jose A., Chahal, Premjeet

Year:

2012

Language:

english

File:

PDF, 425 KB

english, 2012

20

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Design study of electronically steerable half-width microstrip leaky wave antennas

Hejase, Jose A., Myers, Joshua, Kempel, Leo, Chahal, Prem

Year:

2011

Language:

english

File:

PDF, 905 KB

english, 2011

21

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Metamaterial-inspired absorbers for Terahertz packaging applications

Park, Kyoung Youl, Hejase, Jose A., Meierbachtol, Collin S., Wiwatcharagoses, Nophadon, Chahal, Prem

Year:

2011

Language:

english

File:

PDF, 1021 KB

english, 2011

22

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - An air-dielectric via structure for 20Gbps+ board connectors

Wu, Xin, Dunham, David, Na, Nanju, Hejase, Jose A.

Year:

2013

Language:

english

File:

PDF, 901 KB

english, 2013

23

A Multiple Angle Method for THz Time-Domain Material Characterization

Hejase, Jose A., Rothwell, Edward J., Chahal, Premjeet

Journal:

IEEE Transactions on Terahertz Science and Technology

Year:

2013

Language:

english

File:

PDF, 1.88 MB

english, 2013

24

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Terahertz packaging: Study of substrates for novel component designs

Hejase, Jose A., Paladhi, Pavel R., Chahal, Prem

Year:

2010

Language:

english

File:

PDF, 2.07 MB

english, 2010

25

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Design and test of wide-band terahertz dielectric sub-wavelength focusing probes

Hejase, Jose A., Schulte, Brian, Chahal, Prem

Year:

2011

Language:

english

File:

PDF, 1.41 MB

english, 2011

26

[IEEE 2012 IEEE Antennas and Propagation Society International Symposium and USNC/URSI National Radio Science Meeting - Chicago, IL, USA (2012.07.8-2012.07.14)] Proceedings of the 2012 IEEE International Symposium on Antennas and Propagation - A terahertz photonic crystal structure for sensing applications

Acosta Silveira, L. Cecilia, Hejase, Jose A., Chahal, Premjeet

Year:

2012

Language:

english

File:

PDF, 675 KB

english, 2012

27

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Microwave artificially structured periodic media microfluidic sensor

Wiwatcharagoses, Nophadon, Park, Kyoung Youl, Hejase, Jose A., Williamson, Lanea, Chahal, Prem

Year:

2011

Language:

english

File:

PDF, 3.21 MB

english, 2011

28

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - A DC-blocking dielectric waveguide via design for high speed signaling at millimeter wave frequencies

Hejase, Jose A., Na, Nanju, Pham, Nam, Walls, Lloyd

Year:

2013

Language:

english

File:

PDF, 774 KB

english, 2013

29

AIP Conference Proceedings [AIP Publishing LLC 40TH ANNUAL REVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION: Incorporating the 10th International Conference on Barkhausen Noise and Micromagnetic Testing - Baltimore, Maryland, USA (21–26 July 2013)] - Nondestructive millimeter wave imaging and spectroscopy using dielectric focusing probes

Hejase, Jose A., Shane, Steven S., Park, Kyoung Y., Chahal, Premjeet

Year:

2014

Language:

english

File:

PDF, 1.28 MB

english, 2014

30

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - A frequency-domain high-speed bus signal integrity compliance model: Design methodology and implementation

Win, Si T., Hejase, Jose A., Becker, Wiren D., Wiedemeier, Glen A., Dreps, Daniel M.

Year:

2015

Language:

english

File:

PDF, 976 KB

english, 2015

31

[IEEE 2014 IEEE 23rd Electrical Performance of Electronic Packaging and Systems (EPEPS) - Portland, OR, USA (2014.10.26-2014.10.29)] 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems - A low-loss millimeter wave passive frequency band splitting technique

Hejase, Jose A., Dreps, Daniel M., Walls, Lloyd A., Pham, Nam H., Ahmed, Rubina F., Jordan, James D.

Year:

2014

File:

PDF, 995 KB

2014

32

[IEEE 2014 IEEE 23rd Electrical Performance of Electronic Packaging and Systems (EPEPS) - Portland, OR, USA (2014.10.26-2014.10.29)] 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems - High-speed channels and statistical analysis

Wu, Tzong-Lin, Hejase, Jose

Year:

2014

File:

PDF, 88 KB

2014

33

[IEEE 2014 IEEE 23rd Electrical Performance of Electronic Packaging and Systems (EPEPS) - Portland, OR, USA (2014.10.26-2014.10.29)] 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems - A low-loss millimeter wave passive frequency band splitting technique

Hejase, Jose A., Dreps, Daniel M., Walls, Lloyd A., Pham, Nam H., Ahmed, Rubina F., Jordan, James D.

Year:

2014

Language:

english

File:

PDF, 995 KB

english, 2014

34

[IEEE 2014 39th International Conference on Infrared, Millimeter, and Terahertz waves (IRMMW-THz) - Tucson, AZ, USA (2014.9.14-2014.9.19)] 2014 39th International Conference on Infrared, Millimeter, and Terahertz waves (IRMMW-THz) - Millimeter wave and terahertz dielectric probe microfluidic sensors

Chahal, Premjeet, Hejase, Jose A., Shane, Steve, Park, Kyoung Y., Kaur, Amanpreet, Byford, Jennifer

Year:

2014

Language:

english

File:

PDF, 276 KB

english, 2014

35

[IEEE 2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Diego, CA, USA (2016.10.23-2016.10.26)] 2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) - A neural network based method for predicting PCB glass weave induced skew

Hejase, Jose A., Paladhi, Pavel Roy, Krabbenhoft, Roger S., Chen, Zhaoqing, Tang, Junyan, Boday, Dylan J.

Year:

2016

Language:

english

File:

PDF, 551 KB

english, 2016

36

[IEEE 2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Diego, CA, USA (2016.10.23-2016.10.26)] 2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) - A dielectric based waveguide integrated in a multilayer PCB for ultra high speed communications

Tang, Junyan, Hejase, Jose A., Myers, Joshua C., Connor, Samuel R., Dreps, Daniel M., Kuczynski, Joseph

Year:

2016

Language:

english

File:

PDF, 593 KB

english, 2016

37

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Package and Printed Circuit Board Design of a 19.2 Gb/s Data Link for High-Performance Computing

Chun, Sungjun, Hejase, Jose, Tang, Junyan, Audet, Jean, Becker, Dale, Dreps, Daniel, Wiedemeier, Glen, Nguyen, Megan, Walls, Lloyd, Preda, Francesco, Douriet, Daniel

Year:

2017

Language:

english

File:

PDF, 1.68 MB

english, 2017

38

[IEEE 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2017.10.15-2017.10.18)] 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Embeded filtering in PCB integrated ultra high speed dielectric waveguides using photonic band gap structures

Myers, Joshua C., Hejase, Jose A., Tang, Junyan, Dreps, Daniel M.

Year:

2017

Language:

english

File:

PDF, 656 KB

english, 2017

39

[IEEE 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA (2017.10.15-2017.10.18)] 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Effect of NEXT coupling in close proximity to receiver of 25Gb/s bus

Paladhi, Pavel Roy, Hejase, Jose, Pham, Nam, Gholami, Ghadir, Jayaraman, Prasanna, Nguyen, Megan, Wiedemeier, Glen, Dreps, Daniel

Year:

2017

Language:

english

File:

PDF, 511 KB

english, 2017

40

[IEEE 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA (2017.10.15-2017.10.18)] 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - A hybrid land grid array socket connector design for achieving higher signalling data rates

Hejase, Jose A., Chun, Sungjun, Becker, Wiren D., Dreps, Daniel M., Beaman, Brian S.

Year:

2017

Language:

english

File:

PDF, 728 KB

english, 2017

41

[IEEE 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2018.10.14-2018.10.17)] 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Dual-Band Monopole Antenna Feeds for Substrate Integrated Waveguides

RoyPaladhi, Pavel, Hejase, Jose, Tang, Junyan, Myers, Joshua, Chun, Sungjun, Becker, Dale, Dreps, Daniel

Year:

2018

Language:

english

File:

PDF, 1.67 MB

english, 2018

42

[IEEE 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA (2018.10.14-2018.10.17)] 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Bayesian Active Learning for Uncertainty Quantification of High Speed Channel Signaling

Torun, Hakki M., Hejase, Jose A., Tang, Junyan, Beckert, Wiren D., Swaminathan, Madhavan

Year:

2018

Language:

english

File:

PDF, 252 KB

english, 2018

43

[IEEE 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA (2018.10.14-2018.10.17)] 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Vertical and Horizontal Transitions of Substrate Integrated Waveguides Within a Multi-Layered PCB for High Speed Signaling Applications

Myers, Joshua C., Hejase, Jose A., Tang, Junyan, Paladhi, Pavel R., Becker, Wiren D., Chun, Sungjun, Dreps, Daniel M.

Year:

2018

Language:

english

File:

PDF, 713 KB

english, 2018

44

[IEEE 2018 IEEE International Test Conference (ITC) - Phoenix, AZ, USA (2018.10.29-2018.11.1)] 2018 IEEE International Test Conference (ITC) - Polynomial Chaos modeling for jitter estimation in high-speed links

Dolatsara, Majid Ahadi, Yu, Huan, Hejase, Jose Ale, Becker, Wiren Dale, Swaminathan, Madhavan

Year:

2018

File:

PDF, 42 KB

2018

45

[IEEE 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Montreal, QC, Canada (2019.10.6-2019.10.9)] 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Effect and Sensitivity of Postcursor FFE in a 25 Gb/s High Speed Bus Channel

Paladhi, Pavel Roy, Jayaraman, Prasanna, Pham, Nam, Hejase, Jose, Zhang, Yanyan, Tang, Junyan, Myers, Joshua, Chun, Sungjun, Becker, Wiren D., Dreps, Daniel

Year:

2019

File:

PDF, 1005 KB

2019

46

[IEEE 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Montreal, QC, Canada (2019.10.6-2019.10.9)] 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Signal Integrity Considerations of PCB Wiring in Tightly Pitched Module Pin Fields of High Speed Channels

Myers, Joshua C., Hejase, Jose A., Tang, Junyan, Chun, Sungjun, Becker, Wiren D., Dreps, Daniel M.

Year:

2019

File:

PDF, 1.30 MB

2019

47

Worst-Case Eye Analysis of High-Speed Channels Based on Bayesian Optimization

Dolatsara, Majid Ahadi, Hejase, Jose Ale, Becker, Wiren Dale, Kim, Jinwoo, Lim, Sung Kyu, Swaminathan, Madhavan

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2020

File:

PDF, 3.88 MB

2020

48

[IEEE 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2020.10.5-2020.10.7)] 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - RX Equalization for a High-Speed Channel based on Bayesian Active Learning using Dropout

Yang, Xianbo, Tang, Junyan, Torun, Hakki M., Becker, Wiren D., Hejase, Jose A., Swaminathan, Madhavan

Year:

2020

File:

PDF, 165 KB

2020